典型应用 Typical Application 摄像头模组MMC粘接 Camera sensors and MMC 特点描述 Description 单组分、低温快速固化、高强度 Fast curing at low temperatures excellent adhesion 固化时间 Typical Cure time 5-10min
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典型应用
Typical Application
摄像头模组MMC粘接
Camera sensors and MMC
特点描述
Description
单组分、低温快速固化、高强度
Fast curing at low temperatures, excellent adhesion
